SiZ710DT
Vishay Siliconix
N-Channel 20 V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
? Halogen-free According to IEC 61249-2-21
Channel-1
Channel-2
V DS (V)
20
20
R DS(on) ( ? )
0.0068 at V GS = 10 V
0.0090 at V GS = 4.5 V
0.0033 at V GS = 10 V
0.0043 at V GS = 4.5 V
I D (A)
16 a
16 a
35 a
35 a
Q g (Typ.)
6.9 nC
18.2 nC
Definition
? TrenchFET ? Power MOSFETs
? 100 % R g and UIS Tested
? Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
? Notebook System Power
PowerPAIR ? 6 x 3.7
? POL
? Synchronous Buck Converter
Pin 1
1
G 1
D 1
3.73 mm
D 1
D 1
2
3
D 1
G 1
6
G 2
S 2
5
S 1 /D 2
(Pin 7)
S 2
6 mm
N-Channel 1
MOSFET
S 1 /D 2
4
G 2
Orderin g Information:
SiZ710DT-T1-GE3 (Lead (P b )-free and Halogen-free)
N-Channel 2
MOSFET
S 2
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
Parameter
Symbol
Channel-1
Channel-2
Unit
16
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
V DS
V GS
a
20
± 20
35
a
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
16 a
16 a, b, c
35 a
30 b, c
Pulsed Drain Current
Continuous Source Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
15 b, c
70
16 a
3.2 b, c
20
20
24 b, c
100
35 a
3.8 b, c
30
45
A
mJ
T C = 25 °C
27
48
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
17
3.9 b, c
31
4.6 b, c
W
T A = 70 °C
2.5 b, c
3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Channel-1
Channel-2
Parameter
Symbol
Typ.
Max.
Typ.
Max.
Unit
Maximum Junction-to-Ambient b, f t ? 10 s
Maximum Junction-to-Case (Drain) Steady State
R thJA
R thJC
24 32 20 27
3.5 4.6 2 2.6
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 67 °C/W for channel-1 and 65 °C/W for channel-2.
Document Number: 65733
S11-2379-Rev. B, 28-Nov-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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